Center for Semiconductor Physics in Nanostructures
 

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Facilities

Overview | |
Ex Situ Characterization
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Ex Situ Characterization

  • Scanning Probe Microscopy:
    • OU
      •
      • Omicron UHV AFM/STM instrument on MBE system.
      • Custom-built Besoke beetle/RHK Controller STM/STL (Luminescence) instrument.
      • Custom-built UHV STM for semiconductor samples in cross-section.
      • Topometrix Explorer AFM/STM a versatile in-air used to characterize semiconductors, polymers, and plastics.
    • UA
      •
      • Vecco/Digital Instruments Dimension 3100/Nanoscope IV AFM. Imaging modes/features/accessories include topographic (contact and tapping), friction, phase, tunneling/conductive AFM imaging modes, Q-control, Signal Access Module (full signal break-out box), closed-loop scan head (for nanomanipulation/nanolithography).
      • Kodak MDS 120 digital science microscope documentation system.
      • Nikon and Olympus optical microscopes.
      • Meiji metallurgical microscope system.
      • Digital Instruments Dimension 3000/Nanoscope III AFM/SPM.
  • X-ray Diffractometer:
    • OU
      •
      • Philips Materials Research Diffractometer (MRD) with a four-crystal monochromator to characterize MBE samples.
      • Scintag X2 diffractometer optimized for low-angle scattering to characterize mesoscopic and nano-materials.
    • UA
      •
      • Philips X'Pert X-Ray Diffractometer (XRD), includes point and line focus optics, scan modes include standard theta/two-theta, glancing angle (two-theta only), rocking (theta only), pole figures and high resolution (4-crystal monochromator) scans, attachments include an 80K-575K temperature controlled stage and a SAXS (small angle x-ray scattering) attachment.
  • Optical Microscope:
    • OU
      •
      • Nikon OPTIPHOT-66 with Nomarski phase contrast used in evaluating surface morphology.
    • UA
      •
      • Kodak MDS 120 digital science microscope documentation system.
      • Nikon and Olympus optical microscopes.
      • Meiji metallurgical microscope system.
  • Confocal Microscope:
    • OU
      •
    • UA
      •
      • Leica Confocal Microscope, Model TCS-4D. 3D imaging with 0.17-µm lateral resolution.
  • Hall Effect Measurement Station:
    • OU
      •
      • Custom-built PC-driven I/V controllers with closed-cycle He fridge. Used for carrier density and mobility in MBE samples. Magnetic fields up to 0.2T and at temperatures between 6 and 300 K.
    • UA
      •
      • Lakeshore Model 9709 9-Tesla Hall measurement system, variable temperature <2K - 400K
  • SQUID Magnetometer:
    • OU
      •
    • UA
      •
      • Quantum Design MPMS SQUID magnetometer for characterizing the magnetic properties of ferromagnetic layers.
  • NMR Spectrometer:
    • OU
      •
    • UA
      •
      • Bruker DSX-400 NMR spectrometer to perform zero-field NMR characterization of ferromagnetic film structure.
  • Fourier Transform Infrared Spectrometers:
    • OU
      •
      • Biorad FTS-60A FTIR spectrometer for characterizing semiconductor structures from 4.2 to 300 K.
      • Bruker Equinox 55 FTIR spectrometer for characterizing semiconductor structures from 4.2 to 300 K.
    • UA
      •
      • Bruker FTIR/FT-Raman/FT-PL.
  • Photoluminescence Spectrometer:
    • OU
      •
      • Custom-built /Cold finger dewar/McPherson spectrometer with several laser/detector systems that span the range from the visible to near infrared.
    • UA
      •
  • Raman and Micro-Raman Spectrometer:
    • OU
      •
    • UA
      •
      • SPEX 100 includes a high-resolution spectrometer coupled with laser/detector systems that span the range from the visible to the near infrared.
      • Raman and micro-Raman Spectrometer with 514.5 nm laser excitation source.
  • Transmission Electron Microscopes:
    • OU
      •
      • JEOL 2000-FX (200,000 volts) scanning TEM with up to 1,000,000x magnitude, 0.14-nm resolution.
      • ZEISS 10A Conventional Transmission Electron Microscope 200,000x magnitude, 0.14-nm resolution.
    • UA
      •
  • Scanning Electron Microscopes:
    • OU
      •
      • JEOL JSM-880 SEM, with up to 300,000x magnification, 15 angstrom resolution, with Kevex X-ray analyzer.
      • ZEISS DSM-960A SEM, with up to 300,000x magnification, with OXFORD Pentafet x-ray analyzer.
    • UA
      •
      • Hitachi S-2300 SEM with KEvex Mark III X-ray microanalysis.
      • ZFEI XL30-FEG ESEM w/EDAX Phoenix EDS system, attachments/detectors include Peltier and hot stages, <10K - 475K Janis Research cryostage, micromanipulator/nicroinjector, wide-angle detector, back-scattered detector, gaseous SED, Everhart-Thornley SED.
      • Nabity e-beam lithography facility (adjunct to FEI ESEM), includes e-beam writer and all resist handling equipment - etching to be done through HiDEC or MBE facility.